100gm Heat Sink Compound,

299.00

In stock

Usage/Application Industrial
Grade Standard Technical Grade
Packaging Size 100 Gms
Material Heat sink paste
Physical State Paste
Packaging Type 100 Gms 10 pcs in a Shrink pack

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DL HEAT SINK COMPOUND is a heat transfer compound that is formulated with metallic oxide fillers in combination with PDMS fluids to provide excellent thermal conductivity. Its superior thermal conductivity, dielectric constant and dissipation factor makes it suitable for use in both electrical and electronics industries for heat transfer application. It is ideal for application in LED manufacturing, Semiconductors, power diodes, transistors, thermocouples etc. It can be stored for a longer period under suitable storage condition without oil separation

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